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Know your oscilloscope
A fe application have, of necessity, been merelyl touched upon, but they were introduced with the intention of stimulating the curiosity of the reader and possibly leading him into further investigation. This book has been prepared for all users of oscilloscopes. The approach is from a technical viewpoint, but the subject matter does not require an engineering background of the part of the reader in order to be understood.
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Linear Circuit Design Handbook, 2nd edition

Contents: Printed Circuit-Board Design Issues,Overvoltage Effects on Analog Integrated Circuits, Passive Components,Power Management, Analog Filters, Data Converter Support Circuits,Converters, Fundamentals of Sampled Data Systems, RF/IF Circuits, Sensors, Other Linear Circuits,The Op Amp.
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Latchup
The book is targeted for the semiconductor process and device engineer, the circuit designer, ESD engineers and latchup specialists. In this book, a balance is established between the theory, semiconductor technology, circuits, testing and computer-aided design (CAD). The first goal of this book is to teach the fundamentals of the latchup process and design discipline,
to teach the latchup methodology, latchup design practices and CMOS latchup discipline. The second goal is to teach a general methodology of latchup design. This involves understanding of the interrelationship between layout design and device physics, characterization, testing, and process and circuit solutions. With the growing interest in semiconductor management and engineering management, it is also important to understand the business side of CMOS latchup and how this integrates into the business, technology methodology and strategy. The third goal is to present the material that is relevant to many of today’s semiconductor technologies. This book will provide a wide spectrum of technologies including CMOS, RF CMOS, BiCMOS technology, BiCMOS silicon germanium (SiGe) technology, BiCMOS silicon germanium carbon (SiGeC) technology, complementary Bipolar technology, and smart power and image processing
technology; it is valuable to see how the technologies influence the latchup results and solutions. The fourth goal is to expose the reader to the literature in the field of CMOS latchup. An objective of this book is to bridge the gap between the prior work of the 1970s and 1980s and the advanced technologies that are being used in the 1990s, 2000 and beyond. In the early materials, the focus was on semiconductor device physics, device simulation and analytical models. In recent years, the focus has been on new semiconductor process features, CMOS scaling, commercial testing methods and standard development, CAD methodology and tools, and circuit solutions. Thefifth goal is todemonstrate newfailure analysis techniquesandtools. In the last 20 years, a significant number of failure analysis techniques and tools were developed that have been utilized to understand and quantify CMOS latchup; these tools include emission microscopes, CCD camera techniques, the pico-current analysis (PICA) tool, quantum tool
(e.g. SQUID) and other techniques.With these advancements in the field of failure analysis, new issues in latchup can be visualized both spatially and temporally.
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